Browse "Dept. of Mechanical Engineering(기계공학과)" byAuthorHa C.-W.

Showing results 1 to 3 of 3

1
A complete solution to asymmetric S-curve motion profile: Theory & experiments

Ha C.-W.; Rew K.-H.; Kim, Kyung-Sooresearcher, 2008 International Conference on Control, Automation and Systems, ICCAS 2008, pp.2845 - 2849, 2008-10-14

2
Improving reliability of lateral thermosonic flip-chip bonding with ACF

Ha C.-W.; Kim, Kyung-Sooresearcher, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.36 - 39, 2009-12-09

3
Thermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF)

Jang T.-Y.; Ha C.-W.; Kim, Kyung-Sooresearcher, 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, pp.113 - 117, 2009-11-17

Discover

Type

. next

Open Access

Date issued

. next

Subject

. next

rss_1.0 rss_2.0 atom_1.0