Browse "Dept. of Mechanical Engineering(기계공학과)" byAuthorHa, Chang Wan

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Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film

Kim, Kyung Rok; Ha, Chang Wan; Kim, Kyung-Sooresearcher; Yun, Won-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.3, pp.371 - 376, 2014-03

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