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Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Bang, Junghwan

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Showing results 1 to 4 of 4

1
Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate

Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu, MATERIALS CHARACTERIZATION, v.124, pp.250 - 259, 2017-02

2
Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Ko, Yong Ho; Son, Kirak; Kim, Gahui; Park, Young-Bae; Yu, Dong-Yurl; Bang, Junghwan; Kim, Taek-Soo, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.3, pp.2334 - 2341, 2019-02

3
Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Zhang, Shuye; Li, Mingyu, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.533 - 541, 2017-04

4
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07

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