Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject fracture
Showing results 1 to 8 of 8
| A conservation integral for arbitrarily curved interface cracks under thermal loading Chung, HD; Beom, HG; Earmme, YY, ENGINEERING FRACTURE MECHANICS, v.67, no.4, pp.357 - 366, 2000-11 |
| Adhesion energy measurement and interfacial reliability evaluation of synthesized graphene = 합성 그래핀의 접합 에너지 측정 및 계면 신뢰성 평가link Yoon, Tae-Shik; 윤태식; et al, 한국과학기술원, 2013 |
| An application of the two-state M-integral for computing an intensity of a singular near-tip field for a generic wedge Im, Seyoung; Kim, Kyung-Suk, JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, v.48, no.1, pp.129 - 151, 2000-01 |
| COMPARSION OF FORMING AND FRACTURE LIMITS OF AN ALUMINUM ALLOY AND AUSTENITIC STAINLESS STEEL Korhonen, A. S.; Manninen, T.; Yoon, Jeong Whan; Larkiola, J., INTERNATIONAL JOURNAL OF MATERIAL FORMING, v.2, pp.431 - 434, 2009-08 |
| Electrical fracture toughness for a conducting crack in ferroelectric ceramics Beom, HK; Youn, Sung-Kie, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.41, no.1, pp.145 - 157, 2004-01 |
| EVALUATION OF DUCTILE FRACTURE CRITERIA IN A GENERAL THREE-DIMENSIONAL STRESS STATE CONSIDERING THE STRESS TRIAXIALITY AND THE LODE PARAMETER Lou, Yanshan; Huh, Hoon, ACTA MECHANICA SOLIDA SINICA, v.26, no.6, pp.642 - 658, 2013-12 |
| Prediction of fracture forming limit for DP780 steel sheet Lou, Yanshan; Lim, Sung-Jun; Huh, Hoon, METALS AND MATERIALS INTERNATIONAL, v.19, no.4, pp.697 - 705, 2013-07 |
| Understanding mechanical behavior and reliability of organic electronic materials Kim, Jae Han; Lee, Inhwa; Kim, Taek-Soo; Rolston, Nicholas; Watson, Brian L.; Dauskardt, Reinhold H., MRS BULLETIN, v.42, no.2, pp.115 - 123, 2017-02 |
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