Showing results 2 to 5 of 5
Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections Lee, Hyeonchul; Jeong, Minsu; Kim, Gahui; Son, Kirak; Seo, Jeongmin; Kim, Taek-Soo; Park, Young-Bae, ELECTRONIC MATERIALS LETTERS, v.16, no.4, pp.311 - 320, 2020-07 |
Infrared Radiative Properties of Heavily Doped Silicon at Room Temperature Basu, S.; Lee, Bong Jae; Zhang, Z. M., JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, v.132, no.2, 2010-02 |
Mechanical, electrical properties and microstructures of combinatorial Ni-Mo-W alloy films Kim, Kangsan; Park, Sanghun; Kim, Taeyeop; Park, Yuhyun; Sim, Gi-Dong; Lee, Dongwoo, JOURNAL OF ALLOYS AND COMPOUNDS, v.919, 2022-10 |
Soft and Deformable Sensors Based on Liquid Metals Kim, Taeyeong; Kim, Dong-min; Lee, Bong Jae; Lee, Jungchul, SENSORS, v.19, no.19, 2019-10 |
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