Showing results 1 to 10 of 10
A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03 |
Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
Delamination Characteristics of Single Layer and Stacked HTS Coated Conductor for Conduction Cooling Application Park, Heecheol; Jung, Hwanjun; Kim, Seokho; Park, Minwon; Lee, Sangjin; Ha, Hong-soo; Moon, Seung-Hyun; et al, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.23, no.3, 2013-06 |
Delamination Mechanics of Carbon Nanotube Micropillars Brown, Josef; Hajilounezhad, Taher; Dee, Nicholas T.; Kim, Sanha; Hart, A. John; Maschmann, Matthew R., ACS APPLIED MATERIALS & INTERFACES, v.11, no.38, pp.35221 - 35227, 2019-09 |
Direct Measurement of Adhesion Energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process Yoon, Tae-Shik; Shin, Woo-Cheol; Kim, Taek-Yong; Mun, Jeong-Hun; Kim, Taek-Soo; Cho, Byung-Jin, NANO LETTERS, v.12, no.3, pp.1448 - 1452, 2012-03 |
Foreign objects impact damage characteristics of aluminum/composite hybrid drive shaft Kim, HS; Kim, BC; Lim, TS; Lee, Dai Gil, COMPOSITE STRUCTURES, v.66, no.1-4, pp.377 - 389, 2004-10 |
Impact characteristics of glass fiber composites with respect to fiber volume fraction Lee, Dai Gil; Cheon, SS, JOURNAL OF COMPOSITE MATERIALS, v.35, no.1, pp.27 - 56, 2001 |
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
Ultrathin, Flexible, and Transparent Oxide Thin-Film Transistors by Delamination and Transfer Methods for Deformable Displays Ko, Jong Beom; Lee, Seung Hee; Lee, Tae-Ik; Lee, Sangmin; Kim, Jingyu; Kim, Hyeok; Kim, Taek-Soo; et al, ADVANCED MATERIALS TECHNOLOGIES, v.6, no.11, pp.2100431, 2021-11 |
열응력에 의한 실리콘 인터포저 위 금속 패드의 박락 현상 김준모; 김보연; 정청하; 김구성; 김택수, 마이크로전자 및 패키징학회지, v.29, no.3, pp.25 - 29, 2022-09 |
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