Showing results 8 to 10 of 10
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
Ultrathin, Flexible, and Transparent Oxide Thin-Film Transistors by Delamination and Transfer Methods for Deformable Displays Ko, Jong Beom; Lee, Seung Hee; Lee, Tae-Ik; Lee, Sangmin; Kim, Jingyu; Kim, Hyeok; Kim, Taek-Soo; et al, ADVANCED MATERIALS TECHNOLOGIES, v.6, no.11, pp.2100431, 2021-11 |
열응력에 의한 실리콘 인터포저 위 금속 패드의 박락 현상 김준모; 김보연; 정청하; 김구성; 김택수, 마이크로전자 및 패키징학회지, v.29, no.3, pp.25 - 29, 2022-09 |
Discover