Showing results 4 to 5 of 5
Thermally stable and soft pressure-sensitive adhesive for foldable electronics Jo, Woosung; Jeong, Kihoon; Park, Young-Sam; Lee, Jeong-Ik; Im, Sung Gap; Kim, Taek-Soo, CHEMICAL ENGINEERING JOURNAL, v.452, 2023-01 |
광섬유가 삽입된 지능형 복합재료의 저속 충격 및 층간분리 좌굴거동 특성 = Response to low-velocity impact and delamination buckling behavior of smart structure embedded with optical fiberslink 전병선; Jeon, Byoung-Seon; et al, 한국과학기술원, 1997 |
Discover