Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling

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Publisher
Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems
Issue Date
2002-05-30
Language
English
Citation

8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems, 2002, pp.261 - 266

URI
http://hdl.handle.net/10203/126527
Appears in Collection
ME-Conference Papers(학술회의논문)
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