Effect of non-conducting filler additions on anisotropic conductive adhesives (ACAs) properties and the reliability of ACAs flip chip on organic substrates
- Issue Date
- 2000-05-01
- Language
- English
- Citation
50th Electronic Components and Technology Conference, pp.899 - 905
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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- There are no files associated with this item.
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