Fabrication Process and Characterization of High Thermal Conductivity-Low CTE SiCp/Al Metal Matrix Composites for Electronic Packaging Applications
- Publisher
- 복합재료학회
- Issue Date
- 2000-04-01
- Language
- KOR
- Citation
Spring Meeting of the Korean Society for Composites Materials, pp.190 - 194
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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