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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

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dc.contributor.authorAhn, Seung Young-
dc.contributor.authorRyu, Woong Hwan-
dc.contributor.authorYim, Myung-Jin-
dc.contributor.authorLee, Junho-
dc.contributor.authorJeon, Young-Doo-
dc.contributor.authorKim, Woo Poung-
dc.contributor.authorPaik, Kyung-Wook-
dc.contributor.authorKim, Joungho-
dc.date.accessioned2013-03-16T00:47:04Z-
dc.date.available2013-03-16T00:47:04Z-
dc.date.created2012-02-06-
dc.date.issued1999-10-18-
dc.identifier.citationProceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999), v., no., pp.421 - 425-
dc.identifier.issn1089-8190-
dc.identifier.urihttp://hdl.handle.net/10203/125699-
dc.languageENG-
dc.titleOver 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0033341147-
dc.type.rimsCONF-
dc.citation.beginningpage421-
dc.citation.endingpage425-
dc.citation.publicationnameProceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999)-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorAhn, Seung Young-
dc.contributor.nonIdAuthorRyu, Woong Hwan-
dc.contributor.nonIdAuthorYim, Myung-Jin-
dc.contributor.nonIdAuthorLee, Junho-
dc.contributor.nonIdAuthorJeon, Young-Doo-
dc.contributor.nonIdAuthorKim, Woo Poung-
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EE-Conference Papers(학술회의논문)
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