DSpace at KOASAS: Fabrication Process and Thermal Properties of SiCp/Al Composites for Electronic Packaging Applications

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Fabrication Process and Thermal Properties of SiCp/Al Composites for Electronic Packaging Applications

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Hong, Soon Hyung researcher

Issue Date: 1997-01-01

Language: KOR

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URI: http://hdl.handle.net/10203/116428

Appears in Collection: MS-Conference Papers(학술회의논문)

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