A Combined Analysis of Moisture Diffusion with Interface Fracture Mechanics on the Interface Delamination in the Plastic IC Packages during Reflow Soldering

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Issue Date
1998-01-01
Language
ENG
Citation

Pro. Mat. Res. Soc., pp.31 - 36

URI
http://hdl.handle.net/10203/115643
Appears in Collection
MS-Conference Papers(학술회의논문)
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