DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kang, Bong-Chul | ko |
dc.contributor.author | Kno, Jin-Sung | ko |
dc.contributor.author | Yang, Min-Yang | ko |
dc.date.accessioned | 2013-03-11T21:01:59Z | - |
dc.date.available | 2013-03-11T21:01:59Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2011-07 | - |
dc.identifier.citation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.21, no.7 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.uri | http://hdl.handle.net/10203/100272 | - |
dc.description.abstract | Processes based on the liquid-state pattern transfer, like inkjet printing, have critical limitations including low resolution and low electrical conductivity when fabricating electrodes on low thermal resistance flexible substrates such as polyethylene terephthalate (PET). Those are due to the nonlinear transfer mechanism and the limit of the sintering temperature. Although the laser direct curing (LDC) of metallic inks is an alternative process to improve the resolution, it is also associated with the disadvantages of causing thermal damage to the polymer substrate. This paper suggests the laser induced pattern adhesion transfer method to fabricate electrodes of both high electrical conductivity and high resolution on a PET substrate. First, solid patterns are cost-effectively created by the LDC of the organometallic silver ink on a glass that is optically and thermally stable. The solid patterns sintered on the glass are transferred to the PET substrate by the photo-thermally generated adhesion force of the substrate. Therefore, we achieved electrodes with a minimum line width of 10 mu m and a specific resistance of 3.6 mu Omega cm on the PET substrate. The patterns also showed high mechanical reliability. | - |
dc.language | English | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.subject | INK | - |
dc.subject | TEMPERATURE | - |
dc.subject | SURFACES | - |
dc.title | High-resolution and high-conductive electrode fabrication on a low thermal resistance flexible substrate | - |
dc.type | Article | - |
dc.identifier.wosid | 000291935000031 | - |
dc.identifier.scopusid | 2-s2.0-79960068513 | - |
dc.type.rims | ART | - |
dc.citation.volume | 21 | - |
dc.citation.issue | 7 | - |
dc.citation.publicationname | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.contributor.localauthor | Yang, Min-Yang | - |
dc.contributor.nonIdAuthor | Kno, Jin-Sung | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | INK | - |
dc.subject.keywordPlus | TEMPERATURE | - |
dc.subject.keywordPlus | SURFACES | - |
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