Recently Added Documents

11 Class Incremental Learning With Task-Selection

Kim, Eun Sung; Kim, Jung Uk; Lee, Sangmin; Moon, SK; Ro, Yong Manresearcher
IEEE Signal Processing Society, 2020-10-25

12 Estimating Vr Sickness Caused By Camera Shake In Vr Videography

Kim, Seongyeop; Lee, Sangmin; Ro, Yong Manresearcher
IEEE Signal Processing Society, 2020-10-25

13 Machine learning applications in systems metabolic engineering

Kim, Gi Bae; Kim, Won Jun; Kim, Hyun Ukresearcher; Lee, Sang Yupresearcher
CURRENT BIOLOGY LTD, vol. 64, pp. 1 - 9, 2020-08

14 Air-Gap-Insensitive IPT Pad With Ferromagnetic and Conductive Plates

Choi, Jin Soo; Jeong, Seog Y.; Choi, Byeung Guk; Ryu, Seung-Takresearcher; Rim, Chun T.; Kim, Yun-Su
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, vol. 35, no. 8, pp. 7863 - 7872, 2020-08

15 A methodology for diagnosing FAC induced pipe thinning using accelerometers and deep learning models

Chae, Young Ho; Kim, Seung Geun; Kim, Hyeonmin; Kim, Jung Taek; Seong, Poong Hyunresearcher
PERGAMON-ELSEVIER SCIENCE LTD, vol. 143, 2020-08

16 Effects of particle size and surface modification of SiC on the wear behavior of high volume fraction Al/SiCp composites

Lee, Taegyu; Lee, Junho; Lee, Donghyun; Jo, Ilguk; Lee, Sang Kwan; Ryu, Ho Jinresearcher
ELSEVIER SCIENCE SA, vol. 831, 2020-08

17 Lean NOx trap catalysts with high low-temperature activity and hydrothermal stability

Kim, Beom-Sik; Jeong, Hojin; Bae, Junemin; Kim, Pyung Soon; Kim, Chang Hwan; Lee, Hyunjooresearcher
ELSEVIER, vol. 270, 2020-08

18 Chemotactic traveling waves with compact support

Choi, Sun-Ho; Kim, Yong-Jungresearcher
ACADEMIC PRESS INC ELSEVIER SCIENCE, vol. 488, no. 2, 2020-08

19 An Improved Particle Filter With a Novel Hybrid Proposal Distribution for Quantitative Analysis of Gold Immunochromatographic Strips

Zeng, Nianyin; Wang, Zidong; Zhang, Hong; Kim, Kee-Eungresearcher; Li, Yurong; Liu, Xiaohui
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, vol. 18, pp. 819 - 829, 2020-08

20 Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

Tian, Ye; Fang, Heng; Ren, Ning; Zhao, Yatao; Chen, Boli; Wu, Fengshun; Paik, Kyung-Wookresearcher
ELSEVIER SCIENCE SA, vol. 828, 2020-07

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