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| THERMAL C-O BOND SCISSION IN A MU-3-ETA-2-COORDINATED ACYL - STRUCTURAL CHARACTERIZATION OF A DOUBLY BRIDGING 4-ELECTRON OXO LIGAND SHAPLEY, JR; Park, Joon Taik; CHURCHILL, MR; ZILLER, JW; BEANAN, LR, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.106, no.4, pp.1144 - 1145, 1984 |
| Thermal characteristics of composite sandwich structures for machine tool moving body applications Do Suh, J; Lee, Dai Gil, COMPOSITE STRUCTURES, v.66, no.1-4, pp.429 - 438, 2004-10 |
| Thermal characteristics of conduction cooled 600 kJ HTS SMES system Kim, S; Sim, K; Kim, HJ; Bae, JH; Lee, EY; Seong, KC; Jeong, Sangkwon, CRYOGENICS, v.49, pp.294 - 298, 2009-06 |
| Thermal characteristics of InGaP/GaAs HBT ballasted with extended ledge Jeon, S; Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.48, no.10, pp.2442 - 2445, 2001-10 |
| Thermal characteristics of optical gain for GaInNAs quantum wells at 1.3 mu m Kim, CK; Lee, Yong-Hee, APPLIED PHYSICS LETTERS, v.79, no.19, pp.3038 - 3040, 2001-11 |
| Thermal characteristics of organoclay and their effects upon the formation of polypropylene/organoclay nanocomposites Lee, JW; Lim, YT; Park, OOk, POLYMER BULLETIN, v.45, no.2, pp.191 - 198, 2000-09 |
| Thermal characteristics of perforated self-rotating twisted tapes in a double-pipe heat exchanger Zhang, Shaojie; Lu, Lin; Dong, Chuanshuai; Cha, Seung Hyun, APPLIED THERMAL ENGINEERING, v.162, 2019-11 |
| Thermal characteristics of the spindle bearing system with a gear located on the bearing span Choi, JK; Lee, Dai Gil, INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE, v.38, no.9, pp.1017 - 1030, 1998-09 |
| Thermal characteristics of tubular single lap adhesive joints under axial loads Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.15, no.12, pp.1511 - 1528, 2001 |
| Thermal characterization and optimization of pulsating heat pipes operating in a circulation mode Noh, Hyung Yun; Kim, Sung Jin, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.115, pp.1234 - 1246, 2017-12 |
| Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee W.S.; Byun K.Y.; Han I.Y.; Kim, SungJin; Yu J., THERMOCHIMICA ACTA, v.455, no.1-2, pp.148 - 155, 2007-04 |
| Thermal Compatibility of Centrifugally Atomized U-Mo Powders with Al in a Dispersion Fuel Paik, Kyung-Wook; Kim, Ki-Hwan; Lee, Don Bae; Kim, Chang Kyu; Hofman, GL, NUCLEAR ENGINEERING AND DESIGN, v.178, no.1, pp.111 - 117, 1997-12 |
| Thermal compatibility studies of U3Si2 dispersion fuels prepared with centrifugally atomized powder Kim, KH; Park, JM; Kim, CK; Hofman, GL; Paik, Kyung-Wook, JOURNAL OF NUCLEAR MATERIALS, v.270, no.3, pp.315 - 321, 1999-04 |
| Thermal Conductance of Multiple Vacuum/Plate Layer Il Seob Yoon; Song, Tae-Ho, THERMAL SCIENCE AND ENGINEERING, v.13, no.2, pp.29 - 32, 2005 |
| Thermal conduction from microcantilever heaters in partial vacuum Lee, Jungchul; Wright, Tanya L.; Abel, Mark R.; Sunden, Erik O.; Marchenkov, Alexei; Graham, Samuel; King, William P., JOURNAL OF APPLIED PHYSICS, v.101, no.1, 2007-01 |
| Thermal Conductivity and Thermal Boundary Resistances of ALD Al2O3 Films on Si and Sapphire Lee, Seung-Min; Choi, Won Chul; Kim, Junsoo; Kim, Taekwang; Lee, Jaewoo; Im, Sol Yee; Kwon, Jung Yoon; et al, INTERNATIONAL JOURNAL OF THERMOPHYSICS, v.38, no.176, 2017-12 |
| Thermal Conductivity Estimation of Compacted Bentonite Buffer Materials for a High-Level Radioactive Waste Repository Yoon, Seok; Kim, Min-Jun; Lee, Seung-Rae; Kim, Geon-Young, NUCLEAR TECHNOLOGY, v.204, no.2, pp.213 - 226, 2018-10 |
Thermal Conductivity Evaluation of Compacted Bentonite Buffers Considering Temperature Variations Yoon, Seok; Park, Seunghun; Kim, Min-Seop; Kim, Geon-Young; Lee, Seung-Rae, Journal of Nuclear Fuel Cycle and Waste Technology, v.18, no.1, pp.43 - 49, 2020-03 |
| Thermal Conductivity of AlN Ceramics 김도경, 요업기술, v.9, no.6, pp.621 - 629, 1994-06 |
| Thermal conductivity of graphite filled liquid crystal polymer composites and theoretical predictions Ha, Sung Min; Lee, Hoing Lae; Lee, Sung-Goo; Kim, Byoung Gak; Kim, Yong Seok; Won, Jong Chan; Choi, Woo Jin; et al, COMPOSITES SCIENCE AND TECHNOLOGY, v.88, pp.113 - 119, 2013-11 |
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