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Showing results 211601 to 211620 of 275271

211601
WAPK, a Ser/Thr protein kinase gene of Nicotiana tabacum, is uniquely regulated by wounding, abscisic acid and methyl jasmonate

Chung, Won Il, MOLECULAR AND GENERAL GENETICS, v.259, no.5, pp.516 - 522, 1998

211602
War on Intellectual Property between US and China: Law and Development Perspectives

Park, Tae Jung, MANCHESTER JOURNAL OF INTERNATIONAL ECONOMIC LAW, v.19, no.2, pp.197 - 210, 2022-09

211603
War Room Approach Based on Analysis of VOC

Park, Sang Chan, 2nd Bilateral Korea-China Quality Management Symposium, pp.301 - 319, 2002

211604
Waring's problem for rational functions

Im, Bo-Hae, KMS-DMV Joint Conference, Korean Mathematical Society, 2018-10-04

211605
Waring's problem for rational functions in one variable

Im, Bo-Hae, Fudan-KAIST Joint Workshop on Algebra and Geometry, KAIST, 2019-10-11

211606
WARING'S PROBLEM FOR RATIONAL FUNCTIONS IN ONE VARIABLE

Im, Bo-Hae; Larsen, Michael, QUARTERLY JOURNAL OF MATHEMATICS, v.71, no.2, pp.439 - 449, 2020-06

211607
Waring's problem of rational functions in one variable

Im, Bo-Hae, Number Theory online Conference 2020, CARMA and AMSI, University of Newcastle, 2020-06-03

211608
Warm Season Satellite Precipitation Biases for Different Cloud Types Over Western North Pacific

Utsumi, Nobuyuki; Kim, Hyungjun, IEEE GEOSCIENCE AND REMOTE SENSING LETTERS, v.15, no.6, pp.808 - 812, 2018-06

211609
Warm white LEDs에 적용을 위한 3색 발광 $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ 형광체의 합성 및 발광 특성 연구 = Synthesis of tunable full color emitting $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ phosphor for the application to warm white LEDs and its characterizationlink

원유호; Won, Yu-Ho; et al, 한국과학기술원, 2006

211610
Warming Up Your Tick-Tock: Temperature-Dependent Regulation of Circadian Clocks

Ki, Yoonhee; Ri, Hwajung; Lee, Hoyeon; Yoo, Eunseok; Choe, Joonho; Lim, Chunghun, NEUROSCIENTIST, v.21, no.5, pp.503 - 518, 2015-10

211611
Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers

김준모; 이태익; 조우성; 조민수; 김택수, MPC2018 Fall Conference, 대한용접·접합학회, 2018-10-24

211612
Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate

Kim, CG; Lee, T; Kim, MS; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14

211613
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06

211614
Warpage analysis of electroplated Cu films on polymer based packaging core substrate

김철규; 이태익; 김민성; 김택수, MPC2014 Autumn Symposium, MPC, 2014-10-14

211615
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07

211616
Warpage behavior of chip-on-flex(COF) package under thermal cycling condition

Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11

211617
Warpage prediction of chip package using simplified model of PCB substrate = PCB 기판의 단순화 모델을 통한 칩 패키지의 휨 예측link

Kim, Junmo; Kim, Taek-Soo; et al, 한국과학기술원, 2019

211618
Warped dipole completed, with a tower of Higgs bosons

Agashe, Kaustubh; Azatov, Aleksandr; Cui, Yanou; Randall, Lisa; Son, Minho, JOURNAL OF HIGH ENERGY PHYSICS, v.06, no.6, pp.196, 2015-06

211619
Warped Extra Dimensional Benchmarks for Snowmass 2013

Lee, SeungJoon, Snowmass Energy Frontier Workshop, University of Washington, Seattle, USA, 2013-07-02

211620
Warped linear prediction의 효율적 활용에 대한 연구

서성호; 장달원; 유창동, 음성통신 및 신호처리 학술대회, v.19, no.1, pp.123 - 126, 한국음향학회, 2002-08-24

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