Showing results 200641 to 200660 of 275604
Thermo-Elastic Analysis and Three-Dimensional Stress Analysis of Carbon/Carbon Brake Disk Oh, Se-Hee; Yoo, Jae-Seok; Kim, Chun-Gon; Hong, Chang-Sun; Kim, Kwang-Soo; Park, Jong-Hyun, The Third Korea-Japan Symposium of Composite Materials, pp.9 - 10, 2002-10 |
Thermo-elastic Analysis of a Kick Motor Nozzle Incorporating Sptaially Reinforced Composites Yoo, JS; Lee, YM; Lee, SE; Kim, Chun-Gon, 5th International Congress on Thermal Stresses and Related Topics, 5th International Congress on Thermal Stresses and Related Topics, 2003-06 |
Thermo-elastic Frictional Contact Analysis of an Aircraft Braking System KWAK BYUNG MAN, pp.889 - 894, 2001-06-01 |
Thermo-Elasto-Plastic Finite Element Analysis of Quenching Process of Carbon Steel Kang, S.H; Im, Yong-Taek, The Seventh Asia Pacific Conference on Materials Processing, pp.70 -, APCMP, 2006-12-05 |
Thermo-elasto-plastic finite element analysis of quenching process of carbon steel Kang, SH; Im, Yong-Taek, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.192-193, no.SI, pp.381 - 390, 2007-08 |
Thermo-Elastohydrodynamic Analysis of Connecting Rod Bearing in Internal Combustion Engine Kim, BJ; Kim, Kyung-Woong, ASME/STLE International Joint Tribology Conference, 2000-10-01 |
Thermo-elastohydrodynamic analysis of connecting rod bearing in internal combustion engine Kim B.-J.; Kim, Kyung-Woong, JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME, v.123, no.3, pp.444 - 454, 2001-07 |
Thermo-Elastohydrodynamic Analysis of Connecting Rod Bearing: Application to Connecting Rod Bearing Design Kim, BJ; Kim, Kyung-Woong, STLE/ASME International Joint Tribology Conference, 2001-10-01 |
Thermo-fluid investigation on a double-side-cooled annular fuel for the prismatic very high temperature gas-cooled reactor Tak, Nam-Il; Kim, Yonghee; Choi, Jae-Hyuk; Lee, Won Jae, NUCLEAR ENGINEERING AND DESIGN, v.238, no.10, pp.2821 - 2827, 2008-10 |
Thermo-gravimetric analysis method to determine the fiber volume fraction for PAN-based CFRP considering oxidation of carbon fiber and matrix Kim, Yunho; Choi, Chunghyeon; Sathish Kumar, Sarath Kumar; Kim, Chun-Gon; Kim, Sun-Won; Lim, Jae Hyuk, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.102, pp.40 - 47, 2017-07 |
Thermo-hydraulic analysis of the KSTAR central solenoid model coil Chung, WH; Park, S; Wang, QL; Jeong, Sangkwon; Yoon, CS; Oh, YK; Kim, K; et al, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.15, no.2, pp.1411 - 1414, 2005-06 |
Thermo-hydrodynamic behaviors inside a multi-stage-flash evaporator = 다단후레시 증발장치 내에서의 열.수력학적 거동link Seul, Kwang-Won; 설광원; et al, 한국과학기술원, 1991 |
Thermo-mechanical analysis of a cracked fuel pellet and cladding using the finite element method = 유한요소법을 이용한 균열된 핵연료 페레트와 피복관의 열-역학적 분석link Ha, Sang-Jun; 하상준; et al, 한국과학기술원, 1987 |
Thermo-mechanical Analysis of Multi-layered Accident-tolerant fuel (ATF) Claddings 문지원; 류호진, 한국원자력학회 2023 춘계학술발표회, 한국원자력학회, 2023-05-18 |
Thermo-mechanical analysis of road structures used in the on-line electric vehicle system Yang, B. J.; Na, S.; Jang, Jeong Gook; Kim, H. K.; Lee, Haeng-Ki, STRUCTURAL ENGINEERING AND MECHANICS, v.53, no.3, pp.519 - 536, 2015-02 |
Thermo-mechanical behavior of conjugated polymer films for flexible and stretchable organic semiconductors = 유연하고 신축성 있는 유기 반도체를 위한 공액 고분자 박막의 열기계 거동link Ma, Boo Soo; Kim, Taek-Soo; et al, 한국과학기술원, 2022 |
Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging Ju, Min Sang; Kim, Junmo; Gu, Chang-Yeon; Song, Myoung; Ma, Sung Woo; Lee, Jin Hee; Lee, Woong-Sun; et al, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
Thermo-mechanical Finite Element Analysis of Fuel Pellets Containing Lump Burnable Absorbers 김형진; 류호진, 한국원자력학회 2023 추계학술발표회, 한국원자력학회, 2023-10-26 |
Thermo-mechanical properties and bending reliability of polymeric materials for flexible electronics = 유연소자용 고분자 재료의 열기계 물성 및 굽힘 신뢰성 평가link Lee, Tae-Ik; Kim, Taek-Soo; et al, 한국과학기술원, 2019 |
Thermo-Mechanical Reliability Assessment of Thin Electronic Packages with High Density Interconnects using Moire Methods Lee, Soon-Bok, SEM Fall Conference 2014, SEM Fall Conference 2014, 2014-10-21 |
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