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Showing results 200461 to 200480 of 275585
| Thermal Stress Simulation of Mass Concrete Using Thermal Stress Device Kim, Jin-Keun; Amin, MuhammadNasir, 2006 한국콘크리트학회 봄 학술대회, pp.474 - 477, 한국콘크리트학회, 2006-05-11 |
| Thermal Studies of Polymer Electrolytes Based on Poly(oligo[oxyethylene]oxysebacoyl) Park, Jung-Ki; Kim, DW; Lee, YG, 50th Annual Calorimetry Conference, pp.0 - 0, 1995-07-01 |
| Thermal suppression of high-repetition rate SBS pulse compression in liquid media Wang, Hongli; Cha, Seongwoo; Kong, Hong jin; Wang, Yulei; Lu, Zhiwei, OPTICS EXPRESS, v.30, no.21, pp.38995 - 39013, 2022-10 |
| Thermal techniques to improve ZnO-based FBAR devices characteristics Mai L.; Do N.-H.; Hoang T.-A.; Tran V.-S.; Pham L.-P.B.; Thi T.-T.N.; Le H.N.; et al, 2009 International Conference on Advanced Technologies for Communications, ATC 2009, pp.183 - 186, 2009-10-12 |
| Thermal transfer behavior in two types of W-shape ground heat exchangers installed in multilayer soils Yoon, Seok; Lee, Seung Rae; Go, Gyughyun; Xue, Jianfeng; Park, Hyunku; Park, Dowon, GEOMECHANICS AND ENGINEERING, v.6, no.1, pp.79 - 98, 2014-01 |
| Thermal Transformation of Molecular Ni2+-N-4 Sites for Enhanced CO2 Electroreduction Activity Sa, Young Jin; Jung, Hyejin; Shin, Dongyup; Jeong, Hu Young; Ringe, Stefan; Kim, Hyungjun; Hwang, Yun Jeong; et al, ACS CATALYSIS, v.10, no.19, pp.10920 - 10931, 2020-10 |
| Thermal transient characteristics of current leads for superconducting equipment Jeong, Sangkwon; In, Sehwan, International Cryogenic Engineering Conference, pp.629 - 632, 2002-07 |
| Thermal transitions and crystalline structures of regioregularity-controlled poly(3-alkylthiophene)s = 위치 규칙성이 조절된 폴리티오펜 고분자의 열적 변이 및 결정 구조에 대한 연구link Park, Hyeonjung; Kim, Bumjoon; et al, 한국과학기술원, 2022 |
| Thermal transmission line (TTL) and fluidic through silicon via (F-TSV) based embedded cooling structure for high bandwidth memory (HBM) module considering signal and thermal integrity (STI) = 신호 무결성 및 열 무결성을 고려한 고대역폭 메모리 모듈을 위한 열 전송 선로와 유체 흐름용 실리콘 관통 비아 기반 내장형 냉각 구조 설계link Son, Keeyoung; Kim, Joungho; et al, 한국과학기술원, 2021 |
| Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Park, Hyunwook; Shin, TaeIn; Choi, Seonguk; et al, DesignCon 2022, IEEE, 2022-04-07 |
Thermal transport in layer-by-layer assembled polycrystalline graphene films Estrada, David; Li, Zuanyi; Choi, Gyung-Min; Dunham, Simon N.; Serov, Andrey; Lee, Jungchul; Meng, Yifei; et al, Npj 2d Materials and Applications, v.3, 2019-03 |
| Thermal transport properties of thin films of small molecule organic semiconductors Kim, N; Domercq, B; Yoo, Seunghyup; Christensen, A; Kippelen, B; Graham, S, APPLIED PHYSICS LETTERS, v.87, no.24, 2005-12 |
| Thermal Tunning of Colloidal Array in Microcapsules from Crystalline to Glassy Packing 김도은; 박상혁; 김신현, 한국고분자학회 2020 추계학술대회, 한국고분자학회, 2020-10-07 |
| Thermal Unimolecular Decomposition Reactions of Ethyl Bromide at 724.5-755.1$^o$K t.j. park; Jung, Kyung Hoon, BULLETIN OF THE KOREAN CHEMICAL SOCIETY, v.1, pp.30, 1980 |
| Thermal wetting of platinum nanocrystals on silica surface Yu R.; Song, Hyunjoon; Zhang X.-F.; Yang P., JOURNAL OF PHYSICAL CHEMISTRY B, v.109, no.15, pp.6940 - 6943, 2005 |
| THERMAL-ANALYSIS OF HYDROGENATED AMORPHOUS-CARBON FILMS PREPARED BY PLASMA ENHANCED CHEMICAL VAPOR-DEPOSITION M.H. Kim; Lee, Jai Young, JOURNAL OF MATERIALS SCIENCE, v.26, no.17, pp.4787 - 4794, 1991 |
| THERMAL-ANALYSIS OF MAGNETOOPTICAL THIN-FILMS UNDER LASER IRRADIATION Shin, Sung-Chul, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.61, no.3, pp.301 - 306, 1986-10 |
| THERMAL-ANALYSIS OF SOLIDIFICATION BY THE TEMPERATURE RECOVERY METHOD TSZENG, TC; Im, Yong-Taek; KOBAYASHI, S, INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE, v.29, no.1, pp.107 - 120, 1989-01 |
| Thermal-aware energy minimization of 3D-stacked L2 cache through DVFS = 동적 전압 / 주파수 조절을 통한 3차원 적층 캐쉬의 열을 고려한 에너지 최소화link Yun, Woo-Jin; 윤우진; et al, 한국과학기술원, 2012 |
| Thermal-aware energy minimization of 3D-stacked L3 cache with error rate limitation Yun, W.; Kang, K.; Kyung, Chong-Min, 2011 IEEE International Symposium of Circuits and Systems, ISCAS 2011, pp.1672 - 1675, IEEE, 2011-05-15 |
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