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Showing results 7 to 11 of 11

7
Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

Kwon, WS; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.24, pp.135 - 142, 2004-04

8
Kinetics and combustion characteristics of deinking sludge in a thermobalance and an internally circulating fluidized bed

Namkung, W; Roh, SA; Guy, C; Kim, Sang Done, CANADIAN JOURNAL OF CHEMICAL ENGINEERING, v.82, no.5, pp.939 - 947, 2004-10

9
Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

Yim, MJ; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.26, pp.304 - 313, 2006-08

10
Thermal analysis of ball grid array non-volatile memory express solid-state drive in vacuum

Lee, Eung Chang; Rho, Jinsung; Kang, Heeyoub; Lee, Bong Jae, IEEE ELECTRON DEVICE LETTERS, v.39, no.12, pp.1908 - 1911, 2018-12

11
Uncovering the non-radiative thermal characteristics of a passive radiative cooler under real operating conditions

Kocer, Hasan; Durna, Yilmaz; Isik, Halil; Soydan, Mahmut Can; Khalichi, Bahram; Ghobadi, Amir; Kurt, Hamza; et al, JOURNAL OF PHYSICS D-APPLIED PHYSICS, v.56, no.3, 2023-01

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