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Showing results 3 to 9 of 9

3
Effect of process parameters of UV enhanced gas phase cleaning on the removal of PMMA (Polymethylmethacrylate) from a Si substrate

Kwon, Sung Ku; Kim, Do Hyun, TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, v.17, no.4, pp.204 - 207, 2016-08

4
Electrothermally Actuated Lens Scanner and Latching Brake for Free-Space Board-to-Board Optical Interconnects

Chou, Jeffrey B.; Yu, Kyoungsik; Wu, Ming C., JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.21, no.5, pp.1107 - 1116, 2012-10

5
Experimental evaluation of anodic bonding process based on the Taguchi analysis of interfacial fracture toughness

Go, JS; Cho, Young-Ho, SENSORS AND ACTUATORS A-PHYSICAL, v.73, no.1-2, pp.52 - 57, 1999-03

6
Functionalized Bonding Materials and Interfaces for Heterogeneously Layer-Stacked Applications

Kim, Sanghyeon; Han, Jae-Hoon; Choi, Won Jun; Song, Jin Dong; Kim, Hyung-jun, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.74, no.2, pp.82 - 87, 2019-01

7
Reconfigurable RF active bandpass filter with BaxSr1-xTiO3 varactor

Kim, K. B.; Yun, T. S.; Wu, K.; Park, Chul Soon, ELECTRONICS LETTERS, v.44, no.2, pp.135 - 136, 2008-01

8
Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory

Kim, Do Hyun; Yoo, Hyeon Gyun; Hong, Sung Min; Jang, Bongkyun; Park, Dae Yong; Joe, Daniel J.; Kim, Jae-Hyun; et al, ADVANCED MATERIALS, v.28, no.38, pp.8371 - 8378, 2016-10

9
The development of the micro-solid propellant thruster array with improved repeatability

Seo, Daeban; Lee, Jongkwang; Kwon, Sejin, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.22, no.9, 2012-09

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