Browse by Subject UBM

Showing results 5 to 16 of 16

5
Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)

Jang, Se-Young; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.25, no.3, pp.193 - 202, 2002-07

6
Personalized speech emotion recognition using multi-staged data selection = 다계층 자료 선택 기법을 이용한 화자 적응 기반의 음성 감정 인식link

Kim, Jae-Bok; 김재복; et al, 한국과학기술원, 2011

7
Personalized speech emotion recognition using multi-staged data selection = 다계층 자료 선택 기법을 이용한 화자 적응 기반의 음성 감정 인식link

Kim, Jae-Bok; 김재복; et al, 한국과학기술원, 2011

8
Stencil printing으로 형성한 Pb-free solder bump와 UBM(under bump metallurgy) 간의 계면에 관한 연구 = Interfacil studies on the stencil printed Pb-free solder bump and UBM (under bump metallurgy)link

엄지용; Eom, Ji-Yong; et al, 한국과학기술원, 2000

9
Stresses in electroless Ni-P films for electronic packaging applications

Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03

10
Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability

Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05

11
Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability

Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01

12
UBM용 Ni 박막 형성 및 특성에 관한 연구 = Fabrication and characterization of the Ni films for the Applications to UBMlink

김응도; Kim, Eung-Do; et al, 한국과학기술원, 2005

13
무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구 = Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMslink

전영두; Jeon, Young-Doo; et al, 한국과학기술원, 2004

14
무전해 니켈 도금법을 이용한 플립칩 접속용 범프 및 하부금속층에 관한 연구 = A study on the Ni flip chip bumps and under bump metallurgy formation using electroless Ni plating methodslink

전영두; Jeon, Young-Doo; et al, 한국과학기술원, 2000

15
인듐 범프를 이용한 VCSEL 어레이의 플립칩 본딩 최적화 = Optimization of flip chip bonding for a VCSEL array using indium bumpslink

주건모; Chu, Kun-Mo; et al, 한국과학기술원, 2003

16
전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더 범프 형성 방법 = Fabrication method of Ni based under bump metallurgy and sn-ag solder bump by electroplatinglink

김종연; Kim, Jong-Yeon; et al, 한국과학기술원, 2003

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