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Showing results 37 to 37 of 37

37
Void control in adhesive bonding using thermosetting polymer

Nie, Lei; Lee, Kiwon; Lee, Sangyong; Shi, Tielin; Liao, Guanglan, SENSORS AND ACTUATORS A-PHYSICAL, v.167, no.2, pp.398 - 405, 2011-06

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