Browse bySubjectwarpage

Showing results 1 to 8 of 8

1
A study on coining processes of solder bumps on organic substrates

Nah, JW; Paik, Kyung-Wookresearcher; Hwang, TK; Kim, WH, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.26, pp.166 - 172, 2003-04

2
Effects of thermal cycling on material properties of nonconductive pastes (NCPs) and the relationship between material properties and warpage behavior during thermal cycling

Jang, Kyung-Woon; Kim, Hyoung-Joon; Chung, Chang-Kyu; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.3, pp.559 - 565, 2008-09

3
Mechanical property measurement of thin polymer composite laminates for warpage analysis of package substrates = 패키지 기판의 휨 분석을 위한 박형 폴리머 복합체 기판의 기계적 물성 측정link

Lee, Taeik; 이태익; et al, 한국과학기술원, 2015

4
Methodology development of packaging substrate warpage analysis = 패키징 기판의 휨 분석 방법 개발link

Kim, Cheol-Gyu; 김철규; et al, 한국과학기술원, 2014

5
Prediction of shrinkage and warpage in consideration of residual stress in integrated simulation of injection molding

Choi, DS; Im, Yong-Taekresearcher, COMPOSITE STRUCTURES, v.47, no.1-4, pp.655 - 665, 1999-12

6
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Sooresearcher, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06

7
그림자식 모아레를 이용한 PWB의 휨 측정에 관한 연구 = A study on the measurement of PWB warpage using shadow moirelink

이성민; Lee, Sung-Min; et al, 한국과학기술원, 2002

8
단면 연마된 실리콘 웨이퍼의 열에 의한 휨 거동

김준모; 구창연; 김택수researcher, 마이크로전자 및 패키징학회지, v.27, no.3, pp.89 - 93, 2020-09

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