Browse by Subject wafer-level packaging
Showing results 1 to 2 of 2
| Design and evaluation for mechanical strength of an anodically bonded pressurized cavity array for wafer-level MEMS packaging Doh, Il; Cho, Young-Ho, SENSORS AND MATERIALS, v.18, no.5, pp.231 - 240, 2006 |
| Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging Yim, Myung Jin; Li, Yi; Moon, Kyoung-sik; Paik, Kyung-Wook; Wong, C. P., JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.22, no.14, pp.1593 - 1630, 2008 |
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