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Studies on the effects of material design parameters on the board level reliabilities of wafer level chip size package (WLCSP) = 웨이퍼레벨 패키지(WLCSP)의 접합 후 신뢰성에 미치는 재료 설계 인자의 영향에 관한 연구link

Kwon, Yong-Min; 권용민; et al, 한국과학기술원, 2011

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