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Showing results 1 to 10 of 10

1	Effects of plating parameters on alloy composition and microstructure of Sn-Bi electrodeposits from methane sulphonate bath Suh, MS; Park, CJ; Kwon, Hyuk-Sang, SURFACE & COATINGS TECHNOLOGY, v.200, pp.3527 - 3532, 2006-03
2	Effects of substrate morphology and ageing on cycle performance of a Sn-anode fabricated by electroplating Park, JW; Rajendran, S; Kwon, Hyuk-Sang, JOURNAL OF POWER SOURCES, v.159, pp.1409 - 1415, 2006-09
3	Effects of Substrate Morphology and Postelectrodeposition on Structure of Cu Foam and Their Application for Li-Ion Batteries Kim, Ryoung-Hee; Han, Dong-Wook; Nam, Do-Hwan; Kim, Jeong-Han; Kwon, Hyuk-Sang, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.157, no.5, pp.269 - 273, 2010
4	Enhancement of heterogeneous nucleation of beta-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures Cho, Moon Gi; Kim, Hyun You; Seo, Sun-Kyoung; Lee, HyuckMo, APPLIED PHYSICS LETTERS, v.95, no.2, pp.021905-1 - 021905-3, 2009-07
5	N-alkoxyimidoyl bromides as a new and efficient coupling partner in Pd-catalyzed Stille reaction Chang, Sukbok; Lee, M; Kim, Sung Gak, SYNLETT, no.10, pp.1557 - 1558, 2001-10
6	Rational Design of a Hierarchical Tin Dendrite Electrode for Efficient Electrochemical Reduction of CO2 Won, Da Hye; Choi, Chang Hyuck; Chung, Jaehoon; Chung, Min Wook; Kim, Eun-Hee; Woo, Seong-Ihl, CHEMSUSCHEM, v.8, no.18, pp.3092 - 3098, 2015-09
7	Size dependence of lattice deformation induced by growth stress in Sn nanowires Shin, Ho-Sun; Yu, Jin; Song, Jae-Yong; Park, Hyun-Min, APPLIED PHYSICS LETTERS, v.94, no.1, 2009-01
8	Study on the new synthetic reactions using vinylic tellurides = 바이닐 텔루라이드를 이용한 새로운 반응 연구 link Park, Chan-Pil; 박찬필; et al, 한국과학기술원, 2001
9	Template-Free Electrochemical Synthesis of Sn Nanofibers as High-Performance Anode Materials for Na-Ion Batteries Nam, Do-Hwan; Kim, Tae-Hee; Hong, Kyung-Sik; Kwon, Hyuk-Sang, ACS NANO, v.8, no.11, pp.11824 - 11835, 2014-11
10	전기화학적 환원 분석을 통한 Sn의 산화에 대한 연구 조성일; 유진; 강성권; Da-Yuan Shin, 마이크로전자 및 패키징학회지, v.11, no.3, pp.55 - 62, 2004-09

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