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Browse by Subject through-silicon via (TSV) technology▼aTSV capacitance-voltage model▼aTSV capacitance-voltage hysteresis▼aembedded capacitor model▼aHigh Bandwidth Memory (HBM) power distribution network (PDN)

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Non-linear through-silicon via (TSV) and embedded capacitor modeling for analysis of bias-dependent power distribution network (PDN) in high bandwidth memory (HBM) systems = 고대역폭 메모리 시스템의 바이어스 의존적 전력 분배망 분석을 위한 비선형적 실리콘 관통 전극과 내장형 축전기 모델링link

Kim, Dong-Hyun; Kim, Joungho; et al, 한국과학기술원, 2018

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