Browse by Subject through silicon vias (TSVs)

Showing results 1 to 2 of 2

1
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis

Piersanti, Stefano; Pellegrino, Enza; de Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Dong-Hyun; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1329 - 1338, 2017-08

2
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias

Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Kim, Dong-Hyun; Kim, Joungho; Fan, Jun, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.6, pp.1510 - 1516, 2015-12

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