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Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps Lee, Hanmin; Lee, Seyong; Choi, Taejin; Park, Sooin; Ko, Eun Kyoung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.5, pp.924 - 928, 2020-05 |
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