Browse bySubjectthermal analysis

Showing results 1 to 10 of 10

1
An Analytical Approach to Thermal Design and Optimization With a Temperature-Dependent Power Model

Shim, Seongbo; Lee, Jae Wook; Shin, Youngsooresearcher, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.62, no.3, pp.816 - 824, 2015-03

2
An experimental study on thermal conductivity of concrete

Kim, KH; Jeon, SE; Kim, Jin-Keunresearcher; Yang, SC, CEMENT AND CONCRETE RESEARCH, v.33, pp.363 - 371, 2003

3
Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

Yim, MJ; Hwang, J; Paik, Kyung-Wookresearcher, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.27, pp.77 - 84, 2007-01

4
Computer-aided cooling curve analysis of a356 aluminum alloy

Ihsan-ul-haq; Shin, JS; Lee, ZHresearcher, METALS AND MATERIALS INTERNATIONAL, v.10, no.1, pp.89 - 96, 2004

5
Design of wireless power transfer systems with thermal and electromagnetic analyses = 열과 전자기적 분석을 통한 무선전력전송 시스템 설계link

Hwang, Ki-Won; 황기원; et al, 한국과학기술원, 2013

6
Electrothermal Analysis With Nonconvective Boundary Conditions

Choi, Suhyeong; Shim, Seongbo; Shin, Youngsooresearcher, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.65, no.8, pp.1044 - 1048, 2018-08

7
Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

Kwon, WS; Paik, Kyung-Wookresearcher, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.24, pp.135 - 142, 2004-04

8
Kinetics and combustion characteristics of deinking sludge in a thermobalance and an internally circulating fluidized bed

Namkung, W; Roh, SA; Guy, C; Kim, Sang Doneresearcher, CANADIAN JOURNAL OF CHEMICAL ENGINEERING, v.82, no.5, pp.939 - 947, 2004-10

9
Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

Yim, MJ; Paik, Kyung-Wookresearcher, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.26, pp.304 - 313, 2006-08

10
Thermal analysis of ball grid array non-volatile memory express solid-state drive in vacuum

Lee, Eung Chang; Rho, Jinsung; Kang, Heeyoub; Lee, Bong Jaeresearcher, IEEE ELECTRON DEVICE LETTERS, v.39, no.12, pp.1908 - 1911, 2018-12

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