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Growth kinetics of Cu-Snintermetallic compounds at the interface of a Cu substrate and 42Sn-58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints Suh, Min-Suk; Park, Chan-Jin; Kwon, Hyuk-Sang, MATERIALS CHEMISTRY AND PHYSICS, v.110, no.1, pp.95 - 99, 2008-07 |
준고속 변형률 속도에서의 인장실험 및 유한요소법을 이용한 박판 인장시편의 형상결정 = Tension test and specimen design with the finite element method at intermediate strain rateslink 송정한; Song, Jeong-Han; et al, 한국과학기술원, 2002 |
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