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Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

Choi, Jinwoo; Kam, Dong Gun; Chung, Daehyun; Srinivasan, Krishna; Govind, Vinu; Kim, Joungho; Swaminathan, Madhavan, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.2, pp.180 - 190, 2007-05

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