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Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints Shin, SW; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.2, pp.188 - 195, 2005-02 |
Creep rupture of lead-free Sn-3.5Ag-Cu solders Joo, DK; Yu, Jin; Shin, SW, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.6, pp.541 - 547, 2003-06 |
The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints Kang S.K.; Lauro P.; Shin D.-Y.; Henderson D.W.; Bartelo J.; Gosselin T.; Cain S.R.; et al, MATERIALS TRANSACTIONS, v.45, no.3, pp.695 - 702, 2004 |
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