| 1 | (A) study on the effect of Zn on the interfacial reactions and impact reliability of lead-free solder joints = 무연솔더 접합부의 계면 반응과 충격 신뢰성에 Zn가 미치는 영향link Jee, Young-Kun; 지영근; et al, 한국과학기술원, 2010 |
| 2 | BGA 패키지의 열피로 특성에 관한 연구 = A study on thermal fatigue behavior of BGA packagelink 김일호; Kim, Il-Ho; et al, 한국과학기술원, 2004 |
| 3 | Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene Ko, Yong Ho; Lee, Jong-Dae; Yoon, Taeshik; Lee, Chang-Woo; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.8, no.8, pp.5679 - 5686, 2016-03 |
| 4 | Development of a Novel Microimpact-Fatigue Tester and Its Application to Impact Reliability of Lead-Free Solder Joints Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, pp.542 - 549, 2009-09 |
| 5 | Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| 6 | Effects of microstructure on material Behaviors of solder alloys Hwang, TK; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005 |
| 7 | Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads Jee, Young-Kun; Ko, Yong-Ho; Sohn, Yoon-Chul; Yu, Jin, ELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.161 - 166, 2006-12 |
| 8 | Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 |
| 9 | Microstructure of a lead-free composite solder produced by an in-situ process s. y. hwang; j. w. lee; z. h. lee, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.11, pp.1304, 2002 |
| 10 | Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.2, pp.478 - 484, 2008-06 |
| 11 | Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| 12 | Sn-3.5Ag 솔더와 Zn 표면층의 반응을 통한 솔더 계면현상과 충격 신뢰성에 관한 연구 지영근; 유진, 마이크로전자 및 패키징학회지, v.15, no.4, pp.87 - 92, 2008-12 |
| 13 | Thermodynamic issues of lead-free soldering in electronic packaging Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003 |
| 14 | Thermodynamics-aided alloy design and evaluation of Pb-free solders fdr high-temperature applications Kim, Jong Hoon; Jeong, Sang Won; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.43, no.8, pp.1873 - 1878, 2002-08 |
| 15 | Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
| 16 | Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.50, no.9, pp.2291 - 2296, 2009-09 |
| 17 | 기계적 합금화 방법으로 제조된 $Cu_5Zn_8$ -bearing Pb-free 솔더의 Cu 기판에서 젖음성 및 계면반응 = Wetting properties and interfacial reactions of $Cu_5Zn_8$ -bearing Pb-free solders on the cu substrate by MAlink 정인유; Jung, In-Yu; et al, 한국과학기술원, 2009 |
