| 1 | Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems Jang, SY; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.24, no.4, pp.269 - 274, 2001-10 |
| 2 | Cyclic oxidation behavior and recrystallization of cold-rolled Ni3Al foils Kim, SH; Oh, MH; Kishida, K; Hirano, T; Wee, Dang-Moon, MATERIALS LETTERS, v.58, no.22-23, pp.2867 - 2871, 2004-09 |
| 3 | Development of Highly Stable and Mass Transfer-Enhanced Cathode Catalysts: Support-Free Electrospun Intermetallic FePt Nanotubes for Polymer Electrolyte Membrane Fuel Cells Lee, Jaehyuk; Yoo, Ji Mun; Ye, Youngjin; Mun, Yeongdong; Lee, Seonggyu; Kim, Ok-Hee; Rhee, Hee-Woo; et al, ADVANCED ENERGY MATERIALS, v.5, no.11, pp.1402093, 2015-06 |
| 4 | Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 |
| 5 | Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging Cho, Moon Gi; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1501 - 1509, 2007-11 |
| 6 | Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01 |
| 7 | Growth kinetics of Cu-Snintermetallic compounds at the interface of a Cu substrate and 42Sn-58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints Suh, Min-Suk; Park, Chan-Jin; Kwon, Hyuk-Sang, MATERIALS CHEMISTRY AND PHYSICS, v.110, no.1, pp.95 - 99, 2008-07 |
| 8 | IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints Ren, Ning; Fang, Heng; Wang, Dong; Hou, Chenyi; Zhao, Yatao; Chen, Fan; Tian, Ye; et al, MATERIALS, v.13, no.1, 2020-01 |
| 9 | Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal Sohn, WH; Bong, HH; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.355, pp.231 - 240, 2003-08 |
| 10 | PtZn Intermetallic Compound Nanoparticles in Mesoporous Zeolite Exhibiting High Catalyst Durability for Propane Dehydrogenation Han, Seung Won; Park, Hongjun; Han, Jongho; Kim, Jeong-Chul; Lee, John; Jo, Changbum; Ryoo, Ryong, ACS CATALYSIS, v.11, no.15, pp.9233 - 9241, 2021-08 |
| 11 | Sn-3.5Ag 솔더의 벌크 특성과 Ni-P 하부 금속층과의 계면반응에 Co의 첨가가 미치는 영향 = Effects of Co addition on bulk properties of sn-3.5ag solder and interfacial reactions with Ni-P UBMlink 김동훈; Kim, Dong-Hoon; et al, 한국과학기술원, 2008 |
| 12 | Tracking the Mn Diffusion in the Carbon-Supported Nanoparticles Through the Collaborative Analysis of Atom Probe and Evaporation Simulation Jung, Chanwon; Jun, Hosun; Jang, Kyuseon; Kim, Se-Ho; Choi, Pyuck-Pa, MICROSCOPY AND MICROANALYSIS, v.28, no.6, pp.1841 - 1850, 2022-12 |
| 13 | 전기화학적 선택부식을 이용한 연료전지시스템의 고효율 수소생성용 금속간화합물 촉매박판재의 개발 = Development of foil catalysts of intermetallic compounds by electrochemical selective dissolution for highly efficient hydrogen production in the fuel cell systemlink 이혜연; Lee, Hye-Youn; et al, 한국과학기술원, 2011 |
