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Investigation of flip chip under bump metallization systems of Cu pads Nah, JW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.32 - 37, 2002-03 |
Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards Lee, Jong-Bum; Koo, Ja-Myeong; Hong, Soon-Min; Shin, Hyoyoung; Moon, Youn-jin; Jung, Jae-Pil; Yoo, Choon-Don; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.47, no.5, pp.4300 - 4304, 2008-05 |
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