DSpace at KOASAS
Browsing DSpace

Browse by Subject interconnections

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 6 of 6

1
ATOMi: An algorithm for circuit partitioning into multiple FPGAs using time-multiplexed, off-chip, multicasting interconnection architecture

Kwon, YS; Kyung, Chong-Min, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.13, no.7, pp.861 - 864, 2005-07

2
EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks

Zhou, Han; Sun, Zeyu; Sadiqbatcha, Sheriff; Chang, Naehyuck; Tan, Sheldon X. -D., IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.27, no.4, pp.940 - 953, 2019-04

3
Functionalized one-dimensional wires and their interconnections

Kim, H; Chung, HJ; Lee, Jhinhwan; Lee, SJ; Choi, BY; Song, YJ; Kuk, Y, JAPANESE JOURNAL OF APPLIED PHYSICS, v.42, pp.4780 - 4782, 2003-07

4
Improvement of Device Performance by Optimizing the Advanced DCV Process Condition in Dual-Damascene Cu Interconnects

Lee, Min Hyung; Lee, Han Choon; Park, Chul Ho; Han, Jae-Won; Paik, Kyung-Wook, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.8, pp.644 - 647, 2009-06

5
Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Lee, Ki-Won; Kim, Hyoung-Joon; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.4, pp.241 - 247, 2009-10

6
Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05

Discover

rss_1.0 rss_2.0 atom_1.0