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Showing results 1 to 6 of 6

1
200-mm Si CMOS Process-Compatible Integrated Passive Device Stack for Millimeter-Wave Monolithic 3-D Integration

Park, Minsik; Song, Jonghyun; Jeong, Jaeyong; Lim, Jeong-Taek; Song, Jae-Hyeok; Lee, Won-Chul; Sim, Gapseop; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.70, no.10, pp.5257 - 5264, 2023-10

2
A CMOS Power Amplifier With Integrated-Passive-Device Spiral-Shaped Directional Coupler for Mobile UHF RFID Reader

Shim, Sun-Bo; Hong, Song-Cheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.11, pp.2888 - 2897, 2011-11

3
A Quasi-Four-Pair Class-E CMOS RF Power Amplifier With an Integrated Passive Device Transformer

Lee, Hong-Tak; Park, Chang-Kun; Hong, Song-Cheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.57, no.4, pp.752 - 759, 2009-04

4
CMOS RF Power Amplifier for UHF Stationary RFID Reader

Joo, Tae-Hwan; Lee, Hong-Tak; Shim, Sun-Bo; Hong, Song-Cheol, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.20, no.2, pp.106 - 108, 2010-02

5
Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules

Sitaraman, Srikrishna; Sukumaran, Vijay; Pulugurtha, Markondeya Raj; Wu, Zihan; Suzuki, Yuya; Kim, Youngwoo; Sundaram, Venky; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1410 - 1418, 2017-09

6
Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory

Kim, HyunWoong; Park, Jongcheol; Lee, Sanguk; Kim, Jongwook; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.12, pp.1973 - 1988, 2023-12

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