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Showing results 1 to 4 of 4

1
Glass formation in metallic Al-Ni-Y

Kim, Young Kwan; Soh, Jeong Ryong; Kim, Do Kyung; Lee, HyuckMo, JOURNAL OF NON-CRYSTALLINE SOLIDS, v.242, no.2-3, pp.122 - 130, 1998-12

2
Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

Choi, WK; Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.43 - 51, 2002-01

3
Microstructural discovery of Al addition on Sn-0.5Cu-based Pb-free solder design

Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck-Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.650, pp.106 - 115, 2015-11

4
The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12

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