Browse by Subject INTERMETALLIC GROWTH
Showing results 1 to 3 of 3
| CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03 |
| Effects of pd addition on au stud bumps/Al pads interfacial reactions and bond reliability Kim, HJ; Cho, JS; Park, YJ; Lee, J; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.1210 - 1218, 2004-10 |
| Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints Jung, Yong; Yu, Jin, JOURNAL OF APPLIED PHYSICS, v.115, no.8, 2014-02 |
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