Browse by Subject INTERCONNECTS
Showing results 1 to 24 of 24
| 25-Gb/s OOK Transmission Using 1.5-mu m 10G-Class VCSEL for Optical Access Network Zhou, Jingjing; Yu, Changyuan; Mohan, Gurusamy; Kim, Hoon, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.34, no.16, pp.3790 - 3795, 2016-08 |
| 3D printed fluidic valves for remote operation via external magnetic field Kim, Seokbeom; Lee, Jungchul; Choi, Bumkyoo, INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, v.17, no.7, pp.937 - 942, 2016-07 |
| An Improved 100 GHz Equivalent Circuit Model of a Through Silicon Via With Substrate Current Loop Kim, Kibeom; Hwang, Karam; Ahn, Seungyoung, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.26, no.6, pp.425 - 427, 2016-06 |
| Analysis of single-layered multiconductor transmission lines using the fourier transform and mode-matching techniques Park, HH; Kwon, JH; Lee, JW; Eom, Hyo Joon, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.36, no.4, pp.315 - 317, 2003-02 |
| Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene) Lee, WH; Ko, YK; Byun, IJ; Seo, BS; Lee, JG; Reucroft, PJ; Lee, JU; et al, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.19, no.6, pp.2974 - 2978, 2001-11 |
| Effect of electromigration on mechanical shear behavior of flip chip solder joints Nah, JW; Ren, F; Paik, Kyung-Wook; Tu, KN, JOURNAL OF MATERIALS RESEARCH, v.21, pp.698 - 702, 2006-03 |
| Fabrication of thermally stable and cost-effective polymeric waveguide for optical printed-circuit board Kim, Do-Won; Ahn, Seung Ho; Cho, In-Kui; Im, Dong-Min; Muslim, Shirazy Md. Shorab; Park, HyoHoon, OPTICS EXPRESS, v.16, no.21, pp.16798 - 16805, 2008-10 |
| Integration Challenges of Nanoporous Low Dielectric Constant Materials Kim, Taek-Soo; Dauskardt, Reinhold H., IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, v.9, no.4, pp.509 - 515, 2009-12 |
| Interchannel Crosstalk Analysis in Parallel Optical Receiver up to 10 GHz Park, SH; Park, Chul Soon; Karppinen, M; Tanskanen, A; Kautio, K; Karioja, P, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, pp.783 - 793, 2008-11 |
Low-voltage high-performance silicon photonic devices and photonic integrated circuits operating up to 30 Gb/s Kim, Gyungock; Park, Jeong Woo; Kim, In Gyoo; Kim, Sanghoon; Kim, Sanggi; Lee, Jong Moo; Park, Gun Sik; et al, OPTICS EXPRESS, v.19, no.27, pp.26936 - 26947, 2011-12 |
| Metalorganic chemical vapor deposition of copper on ruthenium thin film Kwak, Dong-Kee; Lee, Hyun-Bae; Han, Jae-Won; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.9, no.10, pp.C171 - C173, 2006 |
| Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI Cho, In-Kui; Yun, Jae-Hoon; Jeong, Myung-Yung; Park, HyoHoon, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.722 - 728, 2010-08 |
| Optical transceiver with in-chip temperature compensation module design and fabrication Sangirov, Jamshid; Uddin, Mohammad Rakib; Sangirov, Gulomjon; Ukaegbu, Ikechi Augustine; Lee, Tae-Woo; Park, Hyo-Hoon, OPTICAL AND QUANTUM ELECTRONICS, v.48, no.10, 2016-10 |
| Paper-Based Bimodal Sensor for Electronic Skin Applications Jung, Minhyun; Kim, Kyungkwan; Kim, Bumjin; Cheong, Haena; Shin, Kwanwoo; Kwon, Oh-Sun; Park, Jong-Jin; et al, ACS APPLIED MATERIALS & INTERFACES, v.9, no.32, pp.26974 - 26982, 2017-08 |
| Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer Jeong S.-J.; Shin Y.R.; Kwack W.S.; Lee H.W.; Jeong Y.K.; Kim D.I.; Kim H.C.; et al, SURFACE & COATINGS TECHNOLOGY, v.205, no.21-22, pp.5009 - 5013, 2011-08 |
| Plastic straw: future of high-speed signaling Ha Il, Song; Jin, Huxian; Bae, Hyeon-Min, SCIENTIFIC REPORTS, v.5, 2015-11 |
| Power saving bidirectional optical transceiver design and fabrication Sangirov, Jamshid; Rakib-Uddin, Mohammad; Ukaegbu, Ikechi Augustine; Lee, Tae Woo; Park, Hyo Hoon, OPTICAL AND QUANTUM ELECTRONICS, v.47, no.8, pp.3101 - 3116, 2015-08 |
| Power Saving Rx Design for Optical Modules Sangirov, Jamshid; Ukaegbu, Ikechi Augustine; Nguyen, Nga T. H.; Lee, Tae-Woo; Cho, Mu Hee; Park, Hyo-Hoon, JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, v.24, no.7, 2015-08 |
| Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| Self-assembled three dimensional network designs for soft electronics Jang, Kyung-In; Li, Kan; Chung, Ha Uk; Xu, Sheng; Jung, Han Na; Yang, Yiyuan; Kwak, Jean Won; et al, NATURE COMMUNICATIONS, v.8, 2017-06 |
| Soft network composite materials with deterministic and bio-inspired designs Jang, Kyung-In; Chung, Ha Uk; Xu, Sheng; Lee, Chi Hwan; Luan, Haiwen; Jeong, Jaewoong; Cheng, Huanyu; et al, NATURE COMMUNICATIONS, v.6, 2015-03 |
| Tuning of Vertically-Aligned Carbon Nanotube Diameter and Areal Density through Catalyst Pre-Treatment Nessim, Gilbert D.; Hart, A. John; Kim, Jin S.; Acquaviva, Donatello; Oh, Jihun; Morgan, Caitlin D.; Seita, Matteo; et al, NANO LETTERS, v.8, no.11, pp.3587 - 3593, 2008-11 |
| Two-Dimensionally Stretchable Organic Light-Emitting Diode with Elastic Pillar Arrays for Stress Relief Lim, Myung Sub; Nam, Minwoo; Choi, Seungyeop; Jeon, Yongmin; Son, Young Hyun; Lee, Sung-Min; Choi, Kyung Cheol, NANO LETTERS, v.20, no.3, pp.1526 - 1535, 2020-03 |
| Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3-D-IC Koo, Kyoung-Choul; Kim, Myung-Hoi; Kim, Jonghoon J.; Kim, Joung-Ho; Kim, Ji-Seong, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.3, pp.476 - 488, 2013-03 |
Discover
Type
Open Access
Date issued
- 30,907 2020 - 2024
- 100,009 2010 - 2019
- 75,681 2000 - 2009
- 44,727 1990 - 1999
- 14,360 1980 - 1989
- 62 1964 - 1969