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Showing results 1 to 9 of 9

1	Atomic layer deposition of ruthenium thin films for copper glue layer Kwon, OK; Kim, JH; Park, HS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.2, pp.G109 - G112, 2004-01
2	Development of a Novel Microimpact-Fatigue Tester and Its Application to Impact Reliability of Lead-Free Solder Joints Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, pp.542 - 549, 2009-09
3	Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun , Soung Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11
4	Enhancement of iodine adsorption on ruthenium glue layer for seedless CECVD of Cu Lee, HB; Kwak, DK; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.8, no.2, pp.C39 - C42, 2005
5	Enhancement of Iodine Adsorption Using I2 Plasma for Seedless Catalyst-Enhanced CVD of Copper Kwon, Oh-Kyum; Kim, Jae-Hoon; Park, Hyoung-Sang; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.6, no.8, pp.109 - 111, 2003-06
6	Fabrication and Characterization of the Capillary Performance of Superhydrophilic Cu Micropost Arrays Nam, Youngsuk; Sharratt, Stephen; Byon, Chan; Kim, Sung-Jin; Ju, Y. Sungtaek, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.19, no.3, pp.581 - 588, 2010-06
7	Grain growth of copper films prepared by chemical vapour deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.8, no.4, pp.217 - 221, 1997-08
8	Over GHz low-power RF clock distribution for a multiprocessor digital system Ryu W.; Wai A.L.C.; Wei F.; Lai W.L.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.1, pp.18 - 27, 2002-02
9	Plasma-enhanced atomic layer deposition of ruthenium thin films Kwon, OK; Kwon, SH; Park, HS; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.4, pp.C46 - C48, 2004

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