| 1 | 0, 1, 2)의 응력부식균열 저항성에 미치는 Cu의 영향 = Fe-20Cr-xCu (xlink 안수훈; Ahn, Soo-Hoon; et al, 한국과학기술원, 2011 |
| 2 | 50Pb50In wt% 소더의 Cu, Ni 기판 위에서의 wetting 특성 = Wetting characteristics of 50Pb50In wt% solder on Cu, Ni substrateslink 정영희; Jung, Young-Hy; 유진; 전덕영; et al, 한국과학기술원, 1998 |
| 3 | (A) study on the interfacial reaction between lead-free solders and electroplated Ni or Cu metallization and its effect on mechanical reliability = 무연솔더와 전기도금된 니켈 및 구리와의 계면반응과 기계적 신뢰성에 미치는 영향에 관한 연구link Kim, Jong-Yeon; 김종연; et al, 한국과학기술원, 2008 |
| 4 | Crystalline structure and Cu diffusion barrier property of Ta-Si-N films | [Ta-Si-N Korean source] Jung, Byoung-Hyo; Lee, Won-Jong, KOREAN JOURNAL OF MATERIALS RESEARCH, v.21, no.2, pp.95 - 99, 2011-02 |
| 5 | Cu 기판을 이용한 YBCO 초전도체 선재의 제작과 분석 = Fabrication and characterization of screen-printed YBCO superconductors on Cu plateslink 황현석; Hwang, Hyun-Seok; et al, 한국과학기술원, 2003 |
| 6 | Cu 용액 전극 처리법과 ZnO 고저항 산화막을 이용한 CdTe 태양전지의 단락전류 향상에 관한 연구 = Short circuit current improvement in CdTe solar cells using Cu-solution back contact process and i-ZnO highly resistive transparent layerlink 차은석; Cha, Eun-Seok; et al, 한국과학기술원, 2016 |
| 7 | Cu-based multilayer transparent electrodes: A low-cost alternative to ITO electrodes in organic solar cells Lim, Sooyeon; Han, Donggeon; Kim, Hoyeon; Lee, Soohyun; Yoo, Seunghyup, SOLAR ENERGY MATERIALS AND SOLAR CELLS, v.101, pp.170 - 175, 2012-06 |
| 8 | Cu-free synthesis of screen-printed YBCO superconductor on Cu plates Kim, Y; Hwang, HS; Hong, JI; Kim, S; Han, YH; Han, SC; Sung, TH; et al, PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, v.408, pp.908 - 910, 2004-08 |
| 9 | Cu/Cr 박막과 폴리이미드의 접착에 관한 연구 = A study on the adhesion of Cu/Cr films deposited on polyimidelink 박익성; Park, Ik-Seong; et al, 한국과학기술원, 1997 |
| 10 | Development of a new TL material (LiF:Mg,Cu,Si) with low residual signal and high thermal stability = 잔류선량율이 낮은 LiF:Mg, Cu, Si 열발광 물질의 개발link Rahman, Mohammad Sohelur; Cho, Gyu-Seong; et al, 한국과학기술원, 2005 |
| 11 | Development of blue electroluminescence device using ZnS:Cu = ZnS:Cu를 이용한 청색발광 Electroluminescent 소자 개발 연구link Kim, Dong-Il; 김동일; et al, 한국과학기술원, 1997 |
| 12 | Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps Lee, Hanmin; Lee, Seyong; Choi, Taejin; Park, Sooin; Ko, Eun Kyoung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.5, pp.924 - 928, 2020-05 |
| 13 | Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
| 14 | Effects of Temperature and Operation Parameters on the Galvanic Corrosion of Cu Coupled to Au in Organic Solderability Preservatives Process Oh, Se-Kwon; Kim, YoungJun; Jung, Ki Min; Kim, Jongsoo; Shon, MinYoung; Kwon, HyukSang, METALS AND MATERIALS INTERNATIONAL, v.23, no.2, pp.290 - 297, 2017-03 |
| 15 | Galvanic Corrosion of Cu Coupled to Au on a Print Circuit Board; Effects of Pretreatment Solution and Etchant Concentration in Organic Solderability Preservatives Soft Etching Solution Oh, Se-Kwon; Kim, YoungJun; Shon, MinYoung; Kwon, Hyuk-Sang, METALS AND MATERIALS INTERNATIONAL, v.22, no.5, pp.781 - 788, 2016-09 |
| 16 | Large Grain Ruthenium for Alternative Interconnects Yoon, Seong Jun; Lee, SangJae; Lee, Tae In; Yoon, Alexander; Cho, Byung-Jin, IEEE ELECTRON DEVICE LETTERS, v.40, no.1, pp.91 - 94, 2019-01 |
| 17 | Metal electrodeposition using defect mediated growth = Defect mediated growth법을 이용한 금속의 전기화학적 증착link Hwang, Seong-Pil; 황성필; et al, 한국과학기술원, 2001 |
| 18 | Microstructures and tensile behavior of carbon nanotube reinforced Cu matrix nanocomposites Kim, KT; Cha, Sl; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.430, pp.27 - 33, 2006-08 |
| 19 | Role of Graphene in Reducing Fatigue Damage in Cu/Gr Nanolayered Composite Hwang, Byungil; Kim, Wonsik; Kim, Jaemin; Lee, Subin; Lim, Seoyoen; Kim, Sangmin; Oh, Sang Ho; et al, NANO LETTERS, v.17, no.8, pp.4740 - 4745, 2017-08 |
| 20 | Ta-N 박막의 Cu 확산방지 특성에 관한 연구 = A study on the barrier properties of Ta-n thin films against Cu diffusionlink 장유진; Chang, You-Jean; et al, 한국과학기술원, 1999 |
| 21 | (The) effect of $H_2$ plasma treatment on the film growth rate in catalytic-enhanced Cu CVD = 촉매를 이용한 Cu CVD의 증착속도에 대한 수소 플라즈마의 효과 연구link Kwon, Oh-Kyum; 권오겸; et al, 한국과학기술원, 2001 |
| 22 | Thermodynamic equilibrium calculation of CU(s)-Cl-2(g) reaction Kwon, MS; Lee, JeongYong, APPLIED SURFACE SCIENCE, v.207, pp.158 - 168, 2003-02 |
| 23 | TiN의 Cu 확산방지막 특성 및 그 특성 평가 방법에 관한 연구 = The properties and the characterization methods of TiN as a barrier against Cu diffusionlink 이승윤; Lee, Seung-Yun; et al, 한국과학기술원, 1996 |
| 24 | Two Different Approaches to the Fabrication of Nano-Sized Particles in Thick Polyimide Films Yoon, Junro; Choi, Dong Joo; Lee, Kyu-Hyung; Lee, JeongYong; Kim, Young-Ho, ELECTRONIC MATERIALS LETTERS, v.4, pp.167 - 173, 2008-12 |
| 25 | 구리 기반 다층 투명 전극을 이용한 저가격 및 플렉서블 유기 태양전지 = ITO-free and flexible organic solar cells with Cu-based multilayer transparent electrodes for low cost power generationlink 임수연; Lim, Soo-Yeon; et al, 한국과학기술원, 2011 |
| 26 | 구리 기반 다층 투명 전극을 이용한 저가격 및 플렉서블 유기 태양전지 = ITO-free and flexible organic solar cells with Cu-based multilayer transparent electrodes for low cost power generationlink 임수연; Lim, Soo-Yeon; et al, 한국과학기술원, 2011 |
| 27 | 구리 박막과 반응성 플라즈마의 건식 식각반응 특성에 관한 연구 = A study on the characteristics of dry etch reactions between Cu thin film and reactive plasmaslink 권명석; Kwon, Myoung-Seok; et al, 한국과학기술원, 1999 |
| 28 | 구리확산방지막용 질화텅스텐 박막의 열적 안정성과 미세구조 = Thermal stabilities and microstructures of $WN_x$ films as a Cu diffusion barrierlink 서봉석; Suh, Bong-Seok; et al, 한국과학기술원, 2000 |
| 29 | 반도체 배선용 Cu 박막의 reflow 및 응집 특성 = Reflow and agglomeration of Cu thin films for the interconnect in semiconductor deviceslink 이승윤; Lee, Seung-Yun; et al, 한국과학기술원, 1999 |
| 30 | 알칼리 용액에서 Cu계 합금 리드프레임 및 MOCVD Cu 박막의 산화 특성에 대한 투과 전자현미경 연구 = A TEM study on the oxidation of Cu-Alloy leadframe and MOCVD Cu thin film in alkaline solutionlink 임영수; Lim, Young-Soo; et al, 한국과학기술원, 1997 |
| 31 | 전해도금 Cu와 Sn-3.5Ag 솔더 접합부의 Kirkendall void 형성과 충격 신뢰성에 관한 연구 김종연; 유진, 마이크로전자 및 패키징학회지, v.15, no.1, pp.33 - 37, 2008-03 |
