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Showing results 1 to 3 of 3

1
CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength

Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03

2
Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films

Song, JY; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.21, no.9, pp.2261 - 2269, 2006-09

3
Microstructural discovery of Al addition on Sn-0.5Cu-based Pb-free solder design

Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck-Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.650, pp.106 - 115, 2015-11

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