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Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump

Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoonresearcher; Jeon, DukYoungresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02

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