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Showing results 3 to 6 of 6

3
Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging

Cho, Moon Gi; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1501 - 1509, 2007-11

4
Feasibility assessment of the alumina-forming duplex stainless steels as accident tolerant fuel cladding materials for light water reactors

Kim, Chaewon; Kim, Hyunmyung; Jang, Changheui; Kim, Kangsan; Kim, Yonghee; Lee, Seungjae; Jang, Hun, INTERNATIONAL JOURNAL OF ENERGY RESEARCH, v.44, no.10, pp.8074 - 8088, 2020-08

5
Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump

Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02

6
The role of lanthanum oxide on Pd-only three-way catalysts prepared by co-impregnation and sequential impregnation methods

Kim, DH; Woo, Seong-Ihl; Lee, JM; Yang, OB, CATALYSIS LETTERS, v.70, no.1-2, pp.35 - 41, 2000

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