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Showing results 1 to 6 of 6

1
A study on coining processes of solder bumps on organic substrates

Nah, JW; Paik, Kyung-Wook; Hwang, TK; Kim, WH, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.26, pp.166 - 172, 2003-04

2
Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps

Lee, Hanmin; Lee, Seyong; Choi, Taejin; Park, Sooin; Ko, Eun Kyoung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.5, pp.924 - 928, 2020-05

3
Experimental techniques for fatigue reliability of BGA solder bumps in electronic packaging

Lee, Soon-Bok; Park, TS; Ham, SJ, JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, v.43, no.4, pp.400 - 407, 2000-10

4
Investigation of flip chip under bump metallization systems of Cu pads

Nah, JW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.32 - 37, 2002-03

5
전해도금에 의한 미세 공정 Sn-Bi 솔더 범프 제작에 관한 연구 = Fabrication of small eutectic Sn-Bi solder bumps by electroplatinglink

정회록; Jung, Hoe-Rok; et al, 한국과학기술원, 2003

6
전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더 범프 형성 방법 = Fabrication method of Ni based under bump metallurgy and sn-ag solder bump by electroplatinglink

김종연; Kim, Jong-Yeon; et al, 한국과학기술원, 2003

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