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Showing results 1 to 2 of 2

1
Calcium-Modified Silk Patch as a Next-Generation Ultrasound Coupling Medium

Lee, Sang-Mok; Lee, Taemin; Kim, Hyojung; Jo, Yehhyun; Kim, Myeong Gee; Kim, Subeen; Bae, Hyeon-Min; et al, ACS APPLIED MATERIALS & INTERFACES, v.13, no.47, pp.55827 - 55839, 2021-12

2
Piezoelectric Ceramics and Flexible Printed Circuits' Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly

Park, Jae-Hyeong; Park, Jong Cheol; Lee, SeYong; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1897 - 1903, 2019-09

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